ASROCK Z87 OC Formula User Manual Page 3

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The specification is subject to change without notice. The brand and product names are trademarks of their respective companies. Any configuration other than original product specification is not guaranteed.The specification is subject to change without notice. The brand and product names are trademarks of their respective companies. Any configuration other than original product specification is not guaranteed.
Compared to iron powder chokes, Premium
Alloy Chokes highlight a special alloy formula
which is able to reduce up to 70% core loss.
Moreover, the revolutionary choke
construction features a highly magnetic and
heat resistant design increasing the board's
lifespan.
Designed with a 12 Power Phase Design, this
motherboard features sturdy components
and completely smooth power delivery to the
CPU. Plus, it offers unmatched overclocking
capabilities and enhanced performance with
the lowest temperature for advanced
gamers as well.
By stacking two dies into one MOSFET, DSM
provides larger die area and lower Rds(on),
so the power supply for the CPU Vcore is
more efficient.
This motherboard uses a digital PWM
(Pulse-Width Modulation) design, providing
CPU Vcore voltage more efficiently and
smoothly.
With the combined power of three kinds of
capacitors, MFC allows users to overclock their PC
rig to extreme levels without worrying about the
hardware components.
Twin-Power Cooling combines active air
cooling with water cooling. The ultimate heat
pipe cooling design maximizes the system's
convection to expel hot air, providing better
air flow and faster heat dissipation.
Multi Thermal Sensor provides
users the temperature of various
parts of the motherboard
graphically, so that users may
precisely keep track and control the
temperature of each part of their
motherboard when overclocking.
Status OLED shows various
information of the system on a
new high resolution OLED screen.
Now you can use three buttons to
toggle between information of the
power on self test, debug codes,
the current time, temperatures,
frequencies and voltages of
various points on the
motherboard.
The 8 Layer PCB comes with 4 sets of 2 ounce
copper inner layers, using only carefully
selected copper materials for its PCB layers,
delivering lower temperature and higher
energy efficiency for overclocking.
GELID Solutions GC-Extreme Thermal
Compound is an added bonus that allows
overclockers to stabilize the CPU's
temperature.
With Hi-Density Power Connectors for the
motherboard's CPU power connector, it can
reduce 23% power loss and decrease the
connector's temperature up to 22
o
C.
Compared to other boards that come with
only 3-4µ gold, this motherboard provides 15
µ gold within the CPU socket, DRAM slots
and PCIE x16 slots, thus delivering three
times better performance than usual.
Distortion-Free Slot
Distortion-Free Slot
ASRock's new pin design for the memory
slots that effectively reduces distortion and
promotes performance.
Multi Thermal Sensor
Multi Thermal Sensor
Status OLED
Status OLED
Twin-Power Cooling
Twin-Power Cooling
Multiple Filter Cap
(MFC)
Multiple Filter Cap
(MFC)
COOLING KIT
POWER KIT
POWER KIT
CONNECTOR KIT
CONNECTOR KIT
MONITOR KIT
MONITOR KIT
12 Power Phase Design
12 Power Phase Design
Premium Alloy Choke
(PAC)
Premium Alloy Choke
(PAC)
Dual-Stack MOSFET
(DSM)
Dual-Stack MOSFET
(DSM)
Digi Power
Digi Power
GELID Solutions GC-Extreme
Thermal Compound
GELID Solutions GC-Extreme
Thermal Compound
8 Layer PCB
8 Layer PCB
15µ Gold Finger
15µ Gold Finger
Hi-Density Power Connector
Hi-Density Power Connector
Intel
®
Z87 Chipset
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