ASROCK B75M-DGS User Manual Page 25

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25
Front Panel Audio Header This is an interface for front
(9-pin HD_AUDIO1)
panel audio cable that allows
(see p.12, No. 21)
convenient connection and
control of audio devices.
1. High Denition Audio supports Jack Sensing, but the panel wire on the
chassis must support HDA to function correctly. Please follow the
instruction in our manual and chassis manual to install your system.
2. If you use AC’97 audio panel, please install it to the front panel audio
header as below:
A. Connect Mic_IN (MIC) to MIC2_L.
B. Connect Audio_R (RIN) to OUT2_R and Audio_L (LIN) to OUT2_L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_RET and OUT_RET are for HD audio panel only. You don’t need
to connect them for AC’97 audio panel.
(9-pin USB6_7)
(see p.12, No. 17)
USB 3.0 Header Besides two default USB 3.0
(19-pin USB3_2_3)
ports on the I/O panel, there is
(see p.12, No. 6)
one USB 3.0 header on this
motherboard. This USB 3.0
header can support two USB 3.0
ports.
1
DUMMY
IntA_P1_D+
IntA_P1_D-
GND
IntA_P1_SSTX+
IntA_P1_SSTX-
GND
IntA_P1_SSRX+
IntA_P1_SSRX-
Vbus
IntA_P0_D+
IntA_P0_D-
GND
IntA_P0_SSTX+
IntA_P0_SSTX-
GND
IntA_P0_SSRX+
IntA_P0_SSRX-
Vbus
Infrared Module Header This header supports an
(5-pin IR1)
optional wireless transmitting
(see p.12, No. 23)
and receiving infrared module.
J _SENSE
O UT2_L
1
M IC_RET
P RESENCE#
GND
O UT2_R
M IC2_R
M IC2_L
OUT_RET
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